DYNAMIC MOS
TECHNOLOGY CO., LTD
( NEWS )
- ● FOR SELL / LINTEC RAD-2700 F12 Tape Laminator
- ● SOLD / Advantest T5593 T5375 memory tester 3 sets
- ● SOLD / ARKTEK IDT-1080 ink die tester handler 42 sets
- ● SOLD / DISCO DGP8761+DFM2800 300mm wafer grinder/polisher/mounter
- ● SOLD / K&S Chip mounter 1 set
- ● SOLD / DISCO DFL7161 plus low-k wafer grooving laser saw 2x, DFD6362 dicing saw 2x
- ● SOLD / K&S IConn / IConn ProCu wire bonder 6 sets
- ● SOLD / TOWA Y1 auto molding system
- ● SOLD / DISCO DFD6362 300mm wafer saw 2 sets
- ● SOLD / Samsung SM411 chip mounter 2x
- ● SOLD / Advantest T6373 (ND3) DDI tester 3 sets
- ● SOLD / Fuji NXT-III chip mounter 1x plus Hitachi FS300i II SAT 1x
- ● WANTED / SOFTEX SFX-100FPD X-ray Inspection System / HESSE BJ939 Al Wire Bonder / HONTECH HT-7045 Handler / ASM AD838L Die Bonder
- ● WANTED / DISCO DFL7161 Dicing Saw / DISCO 6000 grit grinding wheel 2 ea GF13-SD6000-V696-50 300X3WX7T-SR / TSK UF300A Wafer Prober 5 sets / ASM AD896-IL08 Die Bonder 1 set / K&S PowerFusion Al Wire Bonder / DISCO DAD3350 DAD3351 DAD3241 Dicing Saw / DATACON 2200apm Die Bonder / FICO Auto Mold System parts
- ● FOR SELL / OXFORD RIE Plasma Plus 80 1 set / ASM Sunbird Inspection System 1 set / Mi Equipment Mi40 Handler 2 set / CASCADE PM300 Wafer Prober 1 set / DAGE4300 bond tester 1 set / RUDOLPH WS3840 3D Bump Metrology 1 set / HAD Wafermate300 Wafer Transfer machine 1 set / LINTEC RAD-2700 F12 Tape Laminator 1 set / NITTO MA3000-II MA3000-III Wafer Mounter 1 set / Fuji XP142E Wafer Mounter 7 set XP143E Wafer Mounter 1 set
- ● SOLD / SEIKO EPSON NS-8040 high speed P/P handler
- ● SOLD / BESI Datacon8800FC Quantum flipchip bonder
- ● SOLD / 1x40' semiconductor equipment
- ● SOLD / DISCO DGP8761+DFM2800 300mm inline wafer grinder
- ● WANTED / VERIGY 93000 Testing parts：DPS32+Gul Cable、MCE Board、pogo tower
- ● FOR SELL / LINTEC RAD-2700 F12 Tape Laminator
- ● SOLD / Advantest T5593 T5375 memory tester 3 sets
- ● SOLD / ARKTEK IDT-1080 ink die tester handler 42 sets
- ● SOLD / DISCO DGP8761+DFM2800 300mm wafer grinder/polisher/mounter
- ● SOLD / K&S Chip mounter 1 set
- ● SOLD / DISCO DFL7161 plus low-k wafer grooving laser saw 2x, DFD6362 dicing saw 2x
- ● SOLD / K&S IConn / IConn ProCu wire bonder 6 sets
- ● SOLD / TOWA Y1 auto molding system
- ● SOLD / DISCO DFD6362 300mm wafer saw 2 sets
- ● SOLD / Samsung SM411 chip mounter 2x
- ● SOLD / Advantest T6373 (ND3) DDI tester 3 sets
- ● SOLD / Fuji NXT-III chip mounter 1x plus Hitachi FS300i II SAT 1x
- ● WANTED / SOFTEX SFX-100FPD X-ray Inspection System / HESSE BJ939 Al Wire Bonder / HONTECH HT-7045 Handler / ASM AD838L Die Bonder
- ● WANTED / DISCO DFL7161 Dicing Saw / DISCO 6000 grit grinding wheel 2 ea GF13-SD6000-V696-50 300X3WX7T-SR / TSK UF300A Wafer Prober 5 sets / ASM AD896-IL08 Die Bonder 1 set / K&S PowerFusion Al Wire Bonder / DISCO DAD3350 DAD3351 DAD3241 Dicing Saw / DATACON 2200apm Die Bonder / FICO Auto Mold System parts
- ● FOR SELL / OXFORD RIE Plasma Plus 80 1 set / ASM Sunbird Inspection System 1 set / Mi Equipment Mi40 Handler 2 set / CASCADE PM300 Wafer Prober 1 set / DAGE4300 bond tester 1 set / RUDOLPH WS3840 3D Bump Metrology 1 set / HAD Wafermate300 Wafer Transfer machine 1 set / LINTEC RAD-2700 F12 Tape Laminator 1 set / NITTO MA3000-II MA3000-III Wafer Mounter 1 set / Fuji XP142E Wafer Mounter 7 set XP143E Wafer Mounter 1 set
- ● SOLD / SEIKO EPSON NS-8040 high speed P/P handler
- ● SOLD / BESI Datacon8800FC Quantum flipchip bonder
- ● SOLD / 1x40' semiconductor equipment
- ● SOLD / DISCO DGP8761+DFM2800 300mm inline wafer grinder
- ● WANTED / VERIGY 93000 Testing parts：DPS32+Gul Cable、MCE Board、pogo tower
ABOUT/
OUR VALUE
Dynamic MOS Technology was established in 2003
for the purpose of providing used semiconductor equipments
to many of the leading semiconductor companies worldwide.
for the purpose of providing used semiconductor equipments
to many of the leading semiconductor companies worldwide.
2003since.
OUR VALUE
Dynamic MOS Technology was
established in 2003 for the purpose
of providing used semiconductor equipments
to many of the leading semiconductor
companies worldwide.
established in 2003 for the purpose
of providing used semiconductor equipments
to many of the leading semiconductor
companies worldwide.
2003since.
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