DYNAMIC MOS
TECHNOLOGY CO., LTD
( NEWS )
- ● FOR SELL / DGP8760+DFM2700 inline wafer grinder
- ● FOR SELL / DISCO DGP8761 研磨机 3 台, 单机版
- ● FOR SELL / LED fab for sale list, 乾式蝕刻機/電漿光阻去除機/自動光阻塗佈機/測試機/劈裂機/電漿清洗機/點測機/拋光機...
- ● FOR SELL / ACCRETECH TSK UF3000LX 300mm wafer prober
- ● FOR SELL / YOKOGAWA ST6730 ST6730A ST6731A DDI tester
- ● FOR SELL / Heller 1913MKIII refloe oven
- ● 宜庭科技捐款台幣5000元支持蔡媽媽狗園給毛孩子們端午加菜
- ● FOR SELL / SEIKO EPSON NS8106XS high speed IC handler
- ● FOR SELL / SEIKO EPSON NS8106MS high speed IC handler
- ● FOR SELL / XYZ Condor100 bond tester
- ● FOR SELL / 封裝測試設備招標出售 K&S IConn 349 台, DISCO DFD6361 DFD6362, Hitachi CM700X, TOWA Y-1....
- ● WANTED / Thermo Fisher MK.2TE ESD and Latch-up Test System
- ● WANTED / ESPEC EHS431 HAST
- ● WANTED / BESI FICO AMS-LM auto molding system
- ● WANTED / APPLIED PRECISION / RUDOLPH PRVX3 Probe card analyzer
- ● FOR SELL / EO BMC204P laser driller for POP
- ● FOR SELL / 精映科技 Avvatech HERMES EC230E C02 bubbler
- ● WANTED / MRSI HVM high volume die bonder
- ● FOR SELL / ASM AB530 wedge bonder
- ● FOR SELL / K&S AT-Premier stud bumping bonder
- ● FOR SELL / DGP8760+DFM2700 inline wafer grinder
- ● FOR SELL / DISCO DGP8761 研磨机 3 台, 单机版
- ● FOR SELL / LED fab for sale list, 乾式蝕刻機/電漿光阻去除機/自動光阻塗佈機/測試機/劈裂機/電漿清洗機/點測機/拋光機...
- ● FOR SELL / ACCRETECH TSK UF3000LX 300mm wafer prober
- ● FOR SELL / YOKOGAWA ST6730 ST6730A ST6731A DDI tester
- ● FOR SELL / Heller 1913MKIII refloe oven
- ● 宜庭科技捐款台幣5000元支持蔡媽媽狗園給毛孩子們端午加菜
- ● FOR SELL / SEIKO EPSON NS8106XS high speed IC handler
- ● FOR SELL / SEIKO EPSON NS8106MS high speed IC handler
- ● FOR SELL / XYZ Condor100 bond tester
- ● FOR SELL / 封裝測試設備招標出售 K&S IConn 349 台, DISCO DFD6361 DFD6362, Hitachi CM700X, TOWA Y-1....
- ● WANTED / Thermo Fisher MK.2TE ESD and Latch-up Test System
- ● WANTED / ESPEC EHS431 HAST
- ● WANTED / BESI FICO AMS-LM auto molding system
- ● WANTED / APPLIED PRECISION / RUDOLPH PRVX3 Probe card analyzer
- ● FOR SELL / EO BMC204P laser driller for POP
- ● FOR SELL / 精映科技 Avvatech HERMES EC230E C02 bubbler
- ● WANTED / MRSI HVM high volume die bonder
- ● FOR SELL / ASM AB530 wedge bonder
- ● FOR SELL / K&S AT-Premier stud bumping bonder


ABOUT/
OUR VALUE
Dynamic MOS Technology was established in 2003
for the purpose of providing used semiconductor equipments
to many of the leading semiconductor companies worldwide.
for the purpose of providing used semiconductor equipments
to many of the leading semiconductor companies worldwide.
2003since.
OUR VALUE
Dynamic MOS Technology was
established in 2003 for the purpose
of providing used semiconductor equipments
to many of the leading semiconductor
companies worldwide.
established in 2003 for the purpose
of providing used semiconductor equipments
to many of the leading semiconductor
companies worldwide.
2003since.
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