DYNAMIC MOS
TECHNOLOGY CO., LTD
( NEWS )
- ● FOR SELL / SHINKAWA UTC-5000NeoCu Wire Bonder
- ● FOR SELL / SHINKAWA UTC-300/UTC-300WE Wire Bonder
- ● FOR SELL / SHINKAWA SPA-300/SPA-300 Super Die Bonder
- ● FOR SELL / HONTECH HT-3309 Test Handler
- ● FOR SELL / DISCO EAD6750S+HANMI SEMHAWK Trim & Form Equipment
- ● FOR SELL / DISCO DFD6361 Dicing Saw
- ● FOR SELL / EO Technics BMC-500 Laser Cutter
- ● FOR SELL / TSK UF200 Wafer Prober
- ● FOR SELL / TSK UF200A Wafer Prober
- ● FOR SELL / TSK UF2000 Wafer Prober
- ● FOR SELL / DISCO DTG8440 Fully Automatic TAIKO Grinder
- ● FOR SELL / TERADYNE J750EX HSD200 1set, J750S HSD100 sets tester
- ● WANTED / DISCO DWR1722 water recycling machine
- ● FOR SELL / DISCO dicing saw theta θ-axis motor repair and exchange solutions
- ● FOR SELL / Accretech TSK UF200 wafer prober
- ● FOR SELL / CHROMA 3306P tester
- ● FOR SELL / PANASONIC CM202-DS chip mounter
- ● FOR SELL / TOWA PMC-1040D auto molding system
- ● FOR SELL / TOWA YPS1120 auto molding system
- ● FOR SELL / ESI 9350 laser repair
- ● FOR SELL / SHINKAWA UTC-5000NeoCu Wire Bonder
- ● FOR SELL / SHINKAWA UTC-300/UTC-300WE Wire Bonder
- ● FOR SELL / SHINKAWA SPA-300/SPA-300 Super Die Bonder
- ● FOR SELL / HONTECH HT-3309 Test Handler
- ● FOR SELL / DISCO EAD6750S+HANMI SEMHAWK Trim & Form Equipment
- ● FOR SELL / DISCO DFD6361 Dicing Saw
- ● FOR SELL / EO Technics BMC-500 Laser Cutter
- ● FOR SELL / TSK UF200 Wafer Prober
- ● FOR SELL / TSK UF200A Wafer Prober
- ● FOR SELL / TSK UF2000 Wafer Prober
- ● FOR SELL / DISCO DTG8440 Fully Automatic TAIKO Grinder
- ● FOR SELL / TERADYNE J750EX HSD200 1set, J750S HSD100 sets tester
- ● WANTED / DISCO DWR1722 water recycling machine
- ● FOR SELL / DISCO dicing saw theta θ-axis motor repair and exchange solutions
- ● FOR SELL / Accretech TSK UF200 wafer prober
- ● FOR SELL / CHROMA 3306P tester
- ● FOR SELL / PANASONIC CM202-DS chip mounter
- ● FOR SELL / TOWA PMC-1040D auto molding system
- ● FOR SELL / TOWA YPS1120 auto molding system
- ● FOR SELL / ESI 9350 laser repair


ABOUT/
OUR VALUE
Dynamic MOS Technology was established in 2003
for the purpose of providing used semiconductor equipments
to many of the leading semiconductor companies worldwide.
for the purpose of providing used semiconductor equipments
to many of the leading semiconductor companies worldwide.
2003since.
OUR VALUE
Dynamic MOS Technology was
established in 2003 for the purpose
of providing used semiconductor equipments
to many of the leading semiconductor
companies worldwide.
established in 2003 for the purpose
of providing used semiconductor equipments
to many of the leading semiconductor
companies worldwide.
2003since.
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