DYNAMIC MOS
TECHNOLOGY CO., LTD
( NEWS )
- ● WANTED / DISCO DFG841 accessory speed reducer
- ● WANTED / DISCO EAD6750+HANMI 20000D cutter/sorter
- ● WANTED / K&S IConn wire bonder
- ● FOR SELL / ACIS-103 Wafer Inspection Machine
- ● FOR SELL / DIC eFlow Antistatic Defoaming Machine
- ● FOR SELL / RUDOLPH PRVX3 Probe Card Repair Machine ( 4500 channels )
- ● FOR SELL / MannCorp MC301N Oven
- ● FOR SELL / BESI ESEC2100 FC Die Bonder
- ● FOR SELL / LINTEC RAD-3500 F/12 12-inch Automatic Tape Laminator
- ● FOR SELL / DISCO DFL7161 Laser grooving Dicing saw
- ● FOR SELL / Yokogawa ST6730 Tester
- ● FOR SELL / HELLER 1809 EXL
- ● FOR SELL / ISMECA NX16 Sorting and Tapeing Machine
- ● FOR SELL / Kla Tencor ICOS T830 Inspection sysyem
- ● WANTED / Accretech TSK UF3000 wafer prober with ND2 docking
- ● WANTED / DSICO DAS8920 surface planner
- ● FOR SELL / ESEC2100FC HS die bonder
- ● FOR SELL / NITTO DR8500-III tape laminator
- ● FOR SELL / Advantest 93K PS1600B 1pcs brand new
- ● FOR SELL / 泰瑞达 TERADYNE Titan SLT 系统及测试分选机
- ● WANTED / DISCO DFG841 accessory speed reducer
- ● WANTED / DISCO EAD6750+HANMI 20000D cutter/sorter
- ● WANTED / K&S IConn wire bonder
- ● FOR SELL / ACIS-103 Wafer Inspection Machine
- ● FOR SELL / DIC eFlow Antistatic Defoaming Machine
- ● FOR SELL / RUDOLPH PRVX3 Probe Card Repair Machine ( 4500 channels )
- ● FOR SELL / MannCorp MC301N Oven
- ● FOR SELL / BESI ESEC2100 FC Die Bonder
- ● FOR SELL / LINTEC RAD-3500 F/12 12-inch Automatic Tape Laminator
- ● FOR SELL / DISCO DFL7161 Laser grooving Dicing saw
- ● FOR SELL / Yokogawa ST6730 Tester
- ● FOR SELL / HELLER 1809 EXL
- ● FOR SELL / ISMECA NX16 Sorting and Tapeing Machine
- ● FOR SELL / Kla Tencor ICOS T830 Inspection sysyem
- ● WANTED / Accretech TSK UF3000 wafer prober with ND2 docking
- ● WANTED / DSICO DAS8920 surface planner
- ● FOR SELL / ESEC2100FC HS die bonder
- ● FOR SELL / NITTO DR8500-III tape laminator
- ● FOR SELL / Advantest 93K PS1600B 1pcs brand new
- ● FOR SELL / 泰瑞达 TERADYNE Titan SLT 系统及测试分选机


ABOUT/
OUR VALUE
Dynamic MOS Technology was established in 2003
for the purpose of providing used semiconductor equipments
to many of the leading semiconductor companies worldwide.
for the purpose of providing used semiconductor equipments
to many of the leading semiconductor companies worldwide.
2003since.
OUR VALUE
Dynamic MOS Technology was
established in 2003 for the purpose
of providing used semiconductor equipments
to many of the leading semiconductor
companies worldwide.
established in 2003 for the purpose
of providing used semiconductor equipments
to many of the leading semiconductor
companies worldwide.
2003since.
INTRO/
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