Dynamic MOS Technology’s
Equipment
LATEST NEWS
PACKAGING ASSEMBLY
- 1H&K BJ820 Al Wire Bonder 4 sets
- 2SHINKAWA ACB3000 Wire Bonder 8 sets
- 3K&S 8028 Wire Bonder 5 sets
- 4K&S Maxum Plus Wire Bonder 6 sets
- 5K&S Maxum Ultra Wire Bonder 15 sets
AUTO TEST EQUIPMENT
- 1TEL P-12XL wafer prober 1 set
- 2ADVANTEST VERIGY PS800 Tester 1 set
- 3ADVANTEST M6300 1 set / M6541AD 2 sets / M6741A 2 sets / M6751A 2 sets / M6751AD 32 sets
- 4SRM XD248 Handler 12 sets
- 5ISMECA NX16, NX32 Handler 8 sets
WAFER FABRICATION
- 1UCP LFC-150 Plasma 1 set
- 2NIKON NSR-S210D KrF Scanner/KrF Stepper
- 3ULVAC ei-7k or ei-5k Batch-type High Vacuum Evaporation System Model: ei
- 4DIC eFlow Anti-Static Defoamer
- 5PLATO 740-720*350 Manual Grinding and Polishing Machine