Dynamic MOS Technology’s
Equipment
LATEST NEWS
PACKAGING ASSEMBLY
- 1DIC eFlow CO2 bubbler 4 sets
- 2ASM Eagle Aero GoCu wire bonder
- 3K&S Opto Lux wire bonder
- 4K&S IConn ProCu Plus wire bonder
- 5K&S IConn ProCu wire bonder
AUTO TEST EQUIPMENT
- 1Advantest V93000 PS1600 SOC tester
- 2ACCRETECH TSK UF3000LX wafer prober 3 set
- 3SYNAX SX11xx 12xx 14xx Handler
- 4Display Color Analyzer CA-310
- 5ADVANTEST V93000 MCB
WAFER FABRICATION
- 1ULVAC ei-7k or ei-5k Batch-type High Vacuum Evaporation System Model: ei
- 2FSE E-Gun/Thermal Evaporator System (Model: FSE-EBS-900 / FU-20PEB-900)
- 3DIC eFlow Anti-Static Defoamer
- 4PLATO 740-720*350 Manual Grinding and Polishing Machine
- 5TEL Tactras Vigus LK2 LK3 plasma etching