Dynamic MOS Technology’s
Equipment
LATEST NEWS
PACKAGING ASSEMBLY
- 1SHINKAWA UTC-5000NeoCu Wire Bonder
- 2SHINKAWA UTC-300/UTC-300WE Wire Bonder
- 3SHINKAWA SPA-300/SPA-300 Super Die Bonder
- 4DISCO EAD6750S+HANMI SEMHAWK Trim & Form Equipment
- 5DISCO DFD6361 Dicing Saw
AUTO TEST EQUIPMENT
- 1KLA ICOS™ T890 Automated Optical Inspection (AOI) System
- 2COHU DELTA DESIGN Matrix II Tri-Temperature Test Handler
- 3HONTECH HT-3309 Test Handler
- 4TSK UF200 Wafer Prober
- 5TSK UF200A Wafer Prober
WAFER FABRICATION
- 1DIC eFlow Anti-Static Defoamer
- 2PLATO 740-720*350 Manual Grinding and Polishing Machine
- 3TEL Tactras Vigus LK2 LK3 plasma etching
- 4ADE Kla Tencor UltraScan 9300 高階晶圓測試量測機
- 5LED fab for sale list, 乾式蝕刻機/電漿光阻去除機/自動光阻塗佈機/測試機/劈裂機/電漿清洗機/點測機/拋光機...