Dynamic MOS Technology’s
Equipment
LATEST NEWS
PACKAGING ASSEMBLY
- 1DSICO DFD6350 dicing saw
- 2ASM Eagle Aero GoCu wire bonder
- 3DISCO DAG810 wafer grinder
- 4DISCO DFL7160 Laser Saw 3 sets / DATACON DS9-100 / DS9000e Sorter 4 sets / MIT M2 Die Sorter 2 sets / TOPCON VI-4302 Wafer Defect Inspection Machine 4 sets / VERIGY V101 Tester 15sets
- 5EVG 520 IS Wafer Bonding System
AUTO TEST EQUIPMENT
- 1Advantest T5503HS memory tester
- 2Techwing TW322XM test handler 2 sets
- 3ADVANTEST T6373 ND3 DDI tester 4 sets for sale
- 4Advantest T5588 memory testing system
- 5ADVANTEST M6751AD Tri temp handler 6 sets
WAFER FABRICATION
- 1Nuflare EBM-8000P/M Variable EB Mask Writer system
- 2WANTED Canon FPA5550iZ load port
- 3Wanted ZEISS Sigma300 FE-SEM
- 46 inch wafer preparing line, SPEEDFAM, DAITO EMTEC
- 5Suss MicroTec aligner/bonder SB8e, BA8, MA8BA8-Gen3 3 sets