Dynamic MOS Technology’s
Equipment
LATEST NEWS
PACKAGING ASSEMBLY
- 1MITSHBISHI 605GTX Laser Drilling Machine 1 set
- 2SHINKAWA UTC-2000Super Wire bonder 11 sets
- 3OKAMOTO GNX300 Wafer grinder 1set
- 4DISCO DAD3350 dicing saw 2023 vintage
- 5K&S IConn plus wire bonder
AUTO TEST EQUIPMENT
- 1ADVANTEST M6751AD Tri temp handler 6 sets
- 2ADVANTEST M6741AD Tri temp handler 17 sets
- 3MIT CAERUS C320 / CAERUS C330 Die sorter 1 set each
- 4SENSOFAR S neox 3D Surface Profiler 1 set
- 5ADVANTEST ND2 T6372 DDI Tester 4
WAFER FABRICATION
- 1WANTED Canon FPA5550iZ load port
- 2Wanted ZEISS Sigma300 FE-SEM
- 36 inch wafer preparing line, SPEEDFAM, DAITO EMTEC
- 4Suss MicroTec aligner/bonder SB8e, BA8, MA8BA8-Gen3 3 sets
- 5Panasonic PSX307 plasma cleaner