Dynamic MOS Technology’s
Equipment
- 項目
- 狀態
- 1ESPEC EHS431 HASTBUY2026-04-18 15:58:442
- 2BESI FICO AMS-LM auto molding systemBUY2026-04-18 15:50:132
- 3MRSI HVM high volume die bonderBUY2026-04-14 08:55:322
- 4EVG 520 IS Wafer Bonding SystemBUY2026-03-10 13:49:231
- 5Okamoto GNX200B wafer grinderBUY2026-03-08 14:16:391
- 6Panasonic PSX307-M Plasma (M type, large chamber)BUY2026-02-03 16:53:561
- 7DISCO DAD3350 Dicing Saw 2 setsBUY2026-02-03 16:50:172
- 8DISCO DFD6361 Dicing Saw 2 setsBUY2026-02-03 16:42:032
- 9DISCO DGP8760+DFM2700 Wafer grinding / polishing / mounting machineBUY2026-02-03 16:09:071
- 10Sonoscan SAT any modelBUY2026-01-07 09:24:322
- 11Wanted K&S RAPID wire bonderBUY2025-12-12 20:41:21100
- 12Wanted Hitachi SU5000 Field Emission Scanning Electron Microscope (SEM)BUY2025-12-10 15:52:021
- 13Wanted FICO AMS-W auto molding system 2 setsBUY2025-12-09 14:38:242
- 14Wanted Shinkawa UTC-100 wire bonderBUY2025-12-09 14:22:322
- 15Wanted Panasonic PSX307-M NM-EFP1A plasma cleanerBUY2025-12-09 14:19:541
- 16Wanted Hesse BJ931 wedge bonderBUY2025-11-13 12:01:033
- 17Wanted DISCO DAD3350 dicing sawBUY2025-11-13 11:52:013
- 18Wanted TOWA YPS2060 molding systemBUY2025-10-28 11:14:102
- 19Wanted ASM AD211 plus die bonderBUY2025-10-28 09:23:002
- 20Wanted Alltec LC100 Laser Marking SystemBUY2025-10-26 09:07:121