Dynamic MOS Technology’s
Equipment
- 項目
- 狀態
- 1NITTO DR8500-II Tape Laminator 2 setsBUY2026-08-21 15:09:122
- 2K&S ConnX Elite Wire Bonder 5 setBUY2026-08-21 15:08:095
- 3ASM AD420 Die bonder 3 setBUY2026-08-21 15:07:163
- 4BESI ESEC2100 HS Die bonder 1 setBUY2026-08-21 15:06:041
- 5DISCO DGP8761+DFM2800 wafer grinder/polisher/mounterBUY2026-08-21 15:04:391
- 6Karl Suss FC150 Flip Chip Bonder 2 setBUY2026-08-21 14:59:122
- 7Besi ESEC2100sD Adv or ESEC2100sD Die bonder 2 setBUY2026-08-21 14:57:432
- 8Mi Equipment Mi30 Mi40 Tape and reel systems 2 setsBUY2026-08-21 14:57:082
- 9HITACHI CM700H Die BonderBUY2026-07-03 16:17:405
- 10K&S IConn Plus or Rapid Wire BonderBUY2026-07-03 16:14:2010
- 11Nitto DR8500-II Tape LaminatorBUY2026-07-03 16:04:333
- 12Maruyama HCL313-LD ChillerBUY2026-07-03 15:48:464
- 13HESSE BJ955 Wire BonderBUY2026-06-29 16:51:321
- 14DISCO DFL7161 Fully Automatic Laser SawBUY2026-06-29 16:34:041
- 15DISCO DFD6340 Dicing SawBUY2026-06-29 16:31:341
- 16ESEC 2100HS Die BonderBUY2026-06-29 16:28:541
- 17HITACHI DB700 Die BonderBUY2026-06-29 16:25:215
- 18ASM Eagle Aero Wire BonderBUY2026-06-29 16:22:295
- 19ASM AD211 Plus II Die BonderBUY2026-06-29 16:18:48
- 20DISCO DWR1722 water recycling machineBUY2026-06-14 13:53:542