Dynamic MOS Technology’s
Equipment
- 項目
- 狀態
- 1TOWA PMC-1040S PMC-1040D Auto Mold System 1 setBUY2026-10-27 13:55:491
- 2DATACON 2200evo G3 Die Bonder 1 setBUY2026-10-27 12:00:341
- 3OKK Face Down OEX-800FD Die SeparatorBUY2026-10-27 11:46:011
- 4DISCO DDS2300 Fully Automatic Die SeparatorBUY2026-10-27 11:43:271
- 5DISCO DFL7341 Fully Automatic Laser SawBUY2026-10-27 11:37:101
- 6NITTO DR8500-II Tape Laminator 2 setsBUY2026-08-21 15:09:122
- 7K&S ConnX Elite Wire Bonder 5 setBUY2026-08-21 15:08:095
- 8ASM AD420 Die bonder 3 setBUY2026-08-21 15:07:163
- 9BESI ESEC2100 HS Die bonder 1 setBUY2026-08-21 15:06:041
- 10DISCO DGP8761+DFM2800 wafer grinder/polisher/mounterBUY2026-08-21 15:04:391
- 11Karl Suss FC150 Flip Chip Bonder 2 setBUY2026-08-21 14:59:122
- 12Besi ESEC2100sD Adv or ESEC2100sD Die bonder 2 setBUY2026-08-21 14:57:432
- 13Mi Equipment Mi30 Mi40 Tape and reel systems 2 setsBUY2026-08-21 14:57:082
- 14HITACHI CM700H Die BonderBUY2026-07-03 16:17:405
- 15K&S IConn Plus or Rapid Wire BonderBUY2026-07-03 16:14:2010
- 16Nitto DR8500-II Tape LaminatorBUY2026-07-03 16:04:333
- 17Maruyama HCL313-LD ChillerBUY2026-07-03 15:48:464
- 18HESSE BJ955 Wire BonderBUY2026-06-29 16:51:321
- 19DISCO DFL7161 Fully Automatic Laser SawBUY2026-06-29 16:34:041
- 20DISCO DFD6340 Dicing SawBUY2026-06-29 16:31:341