Dynamic MOS Technology’s
Equipment
- 項目
- 狀態
- 1Wanted K&S RAPID wire bonderBUY2025-12-12 20:41:21100
- 2Wanted Hitachi SU5000 Field Emission Scanning Electron Microscope (SEM)BUY2025-12-10 15:52:021
- 3Wanted FICO AMS-W auto molding system 2 setsBUY2025-12-09 14:38:242
- 4Wanted Shinkawa UTC-100 wire bonderBUY2025-12-09 14:22:322
- 5Wanted Panasonic PSX307-M NM-EFP1A plasma cleanerBUY2025-12-09 14:19:541
- 6Wanted Hesse BJ931 wedge bonderBUY2025-11-13 12:01:033
- 7Wanted DISCO DAD3350 dicing sawBUY2025-11-13 11:52:013
- 8Wanted TOWA YPS2060 molding systemBUY2025-10-28 11:14:102
- 9Wanted ASM AD211 plus die bonderBUY2025-10-28 09:23:002
- 10Wanted Alltec LC100 Laser Marking SystemBUY2025-10-26 09:07:121
- 11Wanted Takatori ATM-8200 wafer mounterBUY2025-10-26 09:03:001
- 12Wanted NITTO DR8500-III tape laminatorBUY2025-10-24 14:23:541
- 13Wanted MIT Optimus2 die sorterBUY2025-10-23 11:05:581
- 14Wanted ASM MCM-12 multi chip die bonderBUY2025-09-08 10:48:431
- 15Wanted FiconTEC AL300 AL500 AL12000BUY2025-09-08 10:46:135
- 16Wanted Shibaura TFC-3000/3200 inner lead bonderBUY2025-09-08 10:44:431
- 17Wanted Olympus SZ61 microscope 45 degree or 60 degree 100 eachBUY2025-09-06 18:43:34100
- 18Mi Equipment Mi40 / Mi Quantum Die sorter DISCO DFM2700 Wafer Mounter Parts PN : DENSAN DVE-P8247/50-PbF LINTEC RAD-3500 F12 operation software ORION chiller RKS-600S-VA-200-2 DISCO DGP8761 Wafer Grinder, DFG841 Wafer Grinder ASM FT2018 2.5*2.5mm Tape and reel systems SOFTEX SFX-100FPD X-ray Inspection SystemBUY2025-05-15 16:52:201 lot
- 19DISCO DFL7161 Dicing Saw / DISCO 6000 grit grinding wheel 2 ea GF13-SD6000-V696-50 300X3WX7T-SR / TSK UF300A Wafer Prober 5 sets / ASM AD896-IL08 Die Bonder 1 set / K&S PowerFusion Al Wire Bonder / DISCO DAD3350 DAD3351 DAD3241 Dicing Saw / DATACON 2200apm Die Bonder / FICO Auto Mold System partsBUY2025-04-22 15:24:261 lot
- 20DISCO DFG8340 Wafer Grinder 1 setBUY2025-04-07 15:38:471