Dynamic MOS Technology’s
Equipment
- 項目
- 狀態
- 1Wanted ASM MCM-12 multi chip die bonderBUY2025-09-08 10:48:431
- 2Wanted FiconTEC AL300 AL500 AL12000BUY2025-09-08 10:46:135
- 3Wanted Shibaura TFC-3000/3200 inner lead bonderBUY2025-09-08 10:44:431
- 4DISCO DFL7341 stealth saw for mems waferSELL2025-09-06 18:57:011
- 5Wanted Olympus SZ61 microscope 45 degree or 60 degree 100 eachBUY2025-09-06 18:43:34100
- 6K&S AT-Premier plus wafer bonderSELL2025-09-02 09:50:541
- 7DISCO DFD6361 300mm wafer sawSELL2025-09-02 09:49:052
- 8HESSE BondjetT BJ939 heavy wedge wire bonderSELL2025-09-01 08:35:028
- 9ASM AB383 wire bonderSELL2025-08-28 17:03:1313
- 10K&S Rapid wire bonderSELL2025-08-28 17:02:122
- 11ASM AD832i die bonderSELL2025-08-28 17:01:232
- 12TOWA Y1E4120 auto molding systemSELL2025-08-28 16:58:231
- 13ASM die bonder / wire bonder 2x 40' HQ containersSOLD2025-08-26 11:38:401 lot
- 14Shibaura TFC-3000/3200 Inner lead bonder 8 sets, SEC potting system 15 setsSOLD2025-08-26 11:22:061 lot
- 15oven 1 setSOLD2025-08-26 11:11:261
- 16NITTO MSA840 wafer mounterSOLD2025-08-26 09:55:461
- 17DISCO DFD6361 300mm dicing saw, microscope 4xSOLD2025-08-26 09:36:385
- 18DISCO DFP8140 Wafer PolisherSELL2025-08-24 10:51:181
- 19K&S AT-Premier Plus wafer level bonderSELL2025-08-15 08:36:555
- 20PVA TEPLA GIGA690 plasma cleaning systemSELL2025-08-06 13:38:521