01
HOME
02
ABOUT US
03
FOR SALE LIST
04
WANTED LIST
05
INVENTORY
06
EQUIPMENT
CATEGORY
07
CHARITY
08
CONTACT US
EN
|
繁
|
簡
Copyright © DYNAMIC MOS TECHNOLOGY
CO., LTD.All Rights Reserved.
Dynamic MOS Technology’s
Equipment
PACKAGING ASSEMBLY
ATE
WAF
SMT
OTHERS
ALL
BUY
SELL
SOLD
PACKAGING ASSEMBLY
項目
狀態
更新日期
數量
1
DSICO DFD6350 dicing saw
SELL
2026-03-14 10:48:05
1
2
ASM Eagle Aero GoCu wire bonder
SELL
2026-03-12 13:47:23
5
3
DISCO DAG810 wafer grinder
SELL
2026-03-12 08:54:40
1
4
DISCO DFL7160 Laser Saw 3 sets / DATACON DS9-100 / DS9000e Sorter 4 sets / MIT M2 Die Sorter 2 sets / TOPCON VI-4302 Wafer Defect Inspection Machine 4 sets / VERIGY V101 Tester 15sets
SELL
2026-03-10 14:01:25
1 lot
5
EVG 520 IS Wafer Bonding System
BUY
2026-03-10 13:49:23
1
6
Okamoto GNX200B wafer grinder
BUY
2026-03-08 14:16:39
1
7
DISCO DAD3350 dicing saw
SELL
2026-03-07 11:45:32
1
8
DISCO DAD3650 dicing saw
SELL
2026-03-07 11:44:40
1
9
CANON BESTEM-D510 die bonder
SELL
2026-03-07 11:43:26
1
10
ASM Eagle Aero GoCu wire bonder
SELL
2026-03-05 09:59:19
5
11
PVA TEPLA GIGABATCH 380 plasma system
SELL
2026-02-24 11:05:38
1
12
Panasonic PSX307-M Plasma (M type, large chamber)
BUY
2026-02-03 16:53:56
1
13
DISCO DAD3350 Dicing Saw 2 sets
BUY
2026-02-03 16:50:17
2
14
DISCO DFD6361 Dicing Saw 2 sets
BUY
2026-02-03 16:42:03
2
15
DISCO DGP8760+DFM2700 Wafer grinding / polishing / mounting machine
BUY
2026-02-03 16:09:07
1
16
MITSHBISHI 605GTX Laser Drilling Machine 1 set
SELL
2026-01-30 16:37:03
1
17
SHINKAWA UTC-2000Super Wire bonder 11 sets
SELL
2026-01-30 16:05:00
11
18
OKAMOTO GNX300 Wafer grinder 1set
SELL
2026-01-30 15:51:56
1
19
DISCO DAD3350 dicing saw 2023 vintage
SELL
2026-01-17 16:38:17
1
20
K&S IConn plus wire bonder
SELL
2026-01-16 13:37:40
30