Dynamic MOS Technology’s
Equipment
- 項目
- 狀態
- 1ESEC2100FC HS flipchip high speed die bonderSELL2025-07-31 09:17:241
- 2ASAHI WBGA8-80 压模机 1 台SELL2025-07-23 21:12:261
- 3ASAHI TB8 80 压模机 5 台SELL2025-07-23 21:09:265
- 4K&S Maxum Ultra wire bonderSELL2025-07-23 21:06:49100+
- 5ESEC 2100sD D180 300mm die bonderSELL2025-07-23 21:00:5820
- 6Camtek Eagle-i wafer defect inspection systemSELL2025-07-23 14:39:573
- 7ASM AD838 die bonderSELL2025-07-23 09:13:125
- 8DISCO DFG841 wafer back grinderSELL2025-07-17 09:37:182
- 9TOWA FMS3040 jig saw 1 setSOLD2025-07-14 15:58:571
- 10NIKON OLYMPUS microscope 3 setsSOLD2025-07-14 15:54:013
- 11Takatori ATM-1100EF tape laminator 2 setsSOLD2025-07-14 15:51:072
- 12ASM AB838L die bonderSOLD2025-07-14 15:36:401
- 13Fasford DB830plus+ 300mm die bonder 2 setsSOLD2025-07-14 15:32:422
- 14睿智 Wisdom HTLH-UV5-A laser marking systemSELL2025-07-12 10:33:071
- 15睿智 Wisdom DLS1-SP15W UV laser cutting systemSELL2025-07-12 10:28:485
- 16Advantest T5375 memory tester 3 setsSOLD2025-06-27 12:06:103
- 171x40' semiconductor equipmentsSOLD2025-06-27 12:02:181 lot
- 18Renesas CM-700H die bonder 3xSOLD2025-06-27 11:58:373
- 19ASM ISLinDA 300mm die bonder 2x, Twin Eagle Xtreme dual head wire bonder 2x, APT pressure oven 1x, storage tank 3xSOLD2025-06-27 11:50:551 lot
- 20Lintec RAD-2500 m12 300mm semi-auto wafer mounterSOLD2025-06-20 13:48:551