Dynamic MOS Technology’s
Equipment
- 項目
- 狀態
- 1DISCO DFL7341 stealth saw for mems waferSELL2025-09-06 18:57:011
- 2K&S AT-Premier plus wafer bonderSELL2025-09-02 09:50:541
- 3DISCO DFD6361 300mm wafer sawSELL2025-09-02 09:49:052
- 4HESSE BondjetT BJ939 heavy wedge wire bonderSELL2025-09-01 08:35:028
- 5ASM AB383 wire bonderSELL2025-08-28 17:03:1313
- 6K&S Rapid wire bonderSELL2025-08-28 17:02:122
- 7ASM AD832i die bonderSELL2025-08-28 17:01:232
- 8TOWA Y1E4120 auto molding systemSELL2025-08-28 16:58:231
- 9DISCO DFP8140 Wafer PolisherSELL2025-08-24 10:51:181
- 10K&S AT-Premier Plus wafer level bonderSELL2025-08-15 08:36:555
- 11PVA TEPLA GIGA690 plasma cleaning systemSELL2025-08-06 13:38:521
- 12DISCO DFD6362 300mm dicing sawSELL2025-08-04 15:22:562
- 13DISCO DFD6363 300mm dicing sawSELL2025-08-04 15:20:593
- 1412 inch dicing frame/cart/casettsSELL2025-08-04 09:08:11lot
- 15ESEC2100FC HS flipchip high speed die bonderSELL2025-07-31 09:17:241
- 16ASAHI WBGA8-80 压模机 1 台SELL2025-07-23 21:12:261
- 17ASAHI TB8 80 压模机 5 台SELL2025-07-23 21:09:265
- 18K&S Maxum Ultra wire bonderSELL2025-07-23 21:06:49100+
- 19ESEC 2100sD D180 300mm die bonderSELL2025-07-23 21:00:5820
- 20Camtek Eagle-i wafer defect inspection systemSELL2025-07-23 14:39:573