Dynamic MOS Technology’s
Equipment
LATEST NEWS
PACKAGING ASSEMBLY
- 1DSICO DFD6350 dicing saw
- 2ASM Eagle Aero GoCu wire bonder
- 3DISCO DAG810 wafer grinder
- 4DISCO DFL7160 激光划片机 3 台 / DATACON DS9-100 / DS9000e 挑拣机 4 台 / MIT M2 晶粒挑选机 2 台 / TOPCON VI-4302 芯片缺陷检查机 4 台 / VERIGY V101 测试机 15 台
- 5EVG 520 IS Wafer Bonding System
AUTO TEST EQUIPMENT
- 1ADVANTEST T6373 ND3 DDI tester 4 sets for sale
- 2Advantest T5588 memory testing system
- 3爱德万 ADVANTEST M6751AD 三温分选机 6 台
- 4爱德万 ADVANTEST M6741AD 三温分选机 17 台
- 5MIT CAERUS C320 / CAERUS C330 晶粒挑捡机 各 1
WAFER FABRICATION
- 1Nuflare EBM-8000P/M Variable EB Mask Writer system
- 2WANTED Canon FPA5550iZ load port
- 3Wanted ZEISS Sigma300 FE-SEM
- 46 inch wafer preparing line, SPEEDFAM, DAITO EMTEC
- 5Suss MicroTec SB8e, BA8, MA8BA8-Gen3 光罩对准曝光机/焊线机 3 台