Dynamic MOS Technology’s
Equipment
- 項目
- 狀態
- 1XYZ Condor100 bond testerSELL2026-04-30 14:01:031
- 2封裝測試設備招標出售 K&S IConn 349 台, DISCO DFD6361 DFD6362, Hitachi CM700X, TOWA Y-1....SELL2026-04-30 09:22:27multiple
- 3ESPEC EHS431 HASTBUY2026-04-18 15:58:442
- 4BESI FICO AMS-LM auto molding systemBUY2026-04-18 15:50:132
- 5EO BMC204P laser driller for POPSELL2026-04-17 15:18:501
- 6精映科技 Avvatech HERMES EC230E C02 bubblerSELL2026-04-17 15:15:143
- 7MRSI HVM high volume die bonderBUY2026-04-14 08:55:322
- 8ASM AB530 wedge bonderSELL2026-04-14 08:50:4130
- 9K&S AT-Premier stud bumping bonderSELL2026-04-13 14:29:2310
- 10DISCO DFD6362 300mm dicing saw brand new 5 setsSELL2026-04-11 10:54:345
- 11ASM Eagle Aero GoCu wire bonder 2022 vintageSELL2026-03-30 11:42:372
- 12VEECO Optimus ASD-800 dicing sawSELL2026-03-26 09:15:051
- 13NOMURA Super Bubbler-3 CO2 bubblerSELL2026-03-23 16:27:206
- 14DISCO DFD6340 dicing sawSELL2026-03-23 16:20:121
- 15DSICO DFD6350 dicing sawSELL2026-03-14 10:48:051
- 16ASM Eagle Aero GoCu wire bonderSELL2026-03-12 13:47:235
- 17DISCO DAG810 wafer grinderSELL2026-03-12 08:54:401
- 18DISCO DFL7160 雷射切割機 3 台 / DATACON DS9-100 / DS9000e 挑揀機 4 台 / MIT M2 晶粒挑選機 2 台 / TOPCON VI-4302 晶片缺陷檢查機 4 台 / VERIGY V101 測試機 15 台SELL2026-03-10 14:01:251 lot
- 19EVG 520 IS Wafer Bonding SystemBUY2026-03-10 13:49:231
- 20Okamoto GNX200B wafer grinderBUY2026-03-08 14:16:391